Seika Machinery News

TORRANCE, CA — April 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce that effective April 1, 2015, Malcomtech International is a part of Seika Machinery, Inc. (SMI), based in Torrance, CA.

Malcomtech has been selling soldering process control devices for more than 25 years. The company’s location and staff will remain the same; however, Seika Machinery will take over the sales distribution and operations, and the facility will now operate under Seika Machinery, Inc., San Francisco Office.

TORRANCE, CA — February 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut  several new products at IPC APEX EXPO 2015.  

Seika will be showing its newest offering a McDry Yamaha Feeder Cabinet DXU-580YF.  For further information please view product information at the link below.

Download McDry Yamaha Feeder Cabinet DXU-580YF Brochure

TORRANCE, CA — January 2015 — DEN-ON INSTRUMENTS CO., LTD. has appointed Seika Machinery, Inc. as its distributor for North America, effective immediately. Seika Machinery is a leading provider of advanced machinery, materials and engineering services.

TORRANCE, CA — February 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that it will debut four new products at the IPC APEX EXPO. New products to be displayed include the McDry DXU-580YF Yamaha Feeder Cabinet, Musashi Engineering’s SuperΣ and AeroJet, and Hitachi Giken’s NEO VIEW Visual Inspection Support System.

TORRANCE, CA — March 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that it honored its five top representatives with sales awards at the recent IPC APEX EXPO in San Diego.

“Our sales representatives and distributors do an excellent job of presenting Seika products and supporting their local customers. We appreciate their efforts and taking this opportunity to recognize the top performers,” said Michelle Ogihara, Seika Machinery, Inc.’s Senior Sales Manager and Sales/Marketing Manager.

TORRANCE, CA — March 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the new McDry HM-1002BN Nitrogen Auto-Flow Cabinet.

The HM-1002BN dry cabinet saves energy and reduces costs with the low-power mode. It uses less nitrogen compared to standard N2 cabinets due to high-performance drying units. The N2 Auto-Flow system enables quick recovery when opening and closing doors. Additionally, as with all McDry cabinets, the HM-1002BN offers a high quality build, ESD specifications and high performance.

TORRANCE, CA — February 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut  several new products at IPC APEX EXPO 2015.  

Seika will be showing its newest offering, a Visual Inspection Support system for AOI made by Hitachi Giken. Please come to Seika’s booth #3701 to see this new machine. For further information please view product information at the link below.

TORRANCE, CA — February 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut  several new products at IPC APEX EXPO 2015.  

Seika will be showing its newest offering from Musashi Engineering which is a Leading Manufacturer of Dispensing Systems in Japan and Asia. For further information please view product information at the link below.

Download MUSASHI Engineering APEX 2015 Flyer

Den-on Instruments Co., Ltd has announced a limited time special price campaign for the RD500III and RD500SIII SMD Rework station series valid now until the end of August 2015.

The RD500III model can work with large board sizes up to 500mm x 600mm (19.7” x 23.6”) while the more compact RD500SIII model can work with board sizes up to 400mm x 420mm (15.7” x 16.5”).

A novel method purports to locate defects that escape boundary scan and other tests.
Several test methods have been developed to find solder joint defects in printed circuit board assemblies. Capacitance method and IEEE 1149.1 or boundary scan are often used to find opens between component leads and pads on a board. These methods, however, only find complete opens or complete shorts.
Latent defects – ones that can develop after several years of field use – have not been found by conventional methods.