TORRANCE, CA — February 2015 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut several new products at IPC APEX EXPO 2015.
Seika will be showing its newest offering from Musashi Engineering which is a Leading Manufacturer of Dispensing Systems in Japan and Asia. For further information please view product information at the link below.
Den-on Instruments Co., Ltd has announced a limited time special price campaign for the RD500III and RD500SIII SMD Rework station series valid now until the end of August 2015.
The RD500III model can work with large board sizes up to 500mm x 600mm (19.7” x 23.6”) while the more compact RD500SIII model can work with board sizes up to 400mm x 420mm (15.7” x 16.5”).
A novel method purports to locate defects that escape boundary scan and other tests.
Several test methods have been developed to find solder joint defects in printed circuit board assemblies. Capacitance method and IEEE 1149.1 or boundary scan are often used to find opens between component leads and pads on a board. These methods, however, only find complete opens or complete shorts.
Latent defects – ones that can develop after several years of field use – have not been found by conventional methods.
TORRANCE, CA — April 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its top McDry sales representatives for 2013. The awards were presented to the companies during a Wednesday, March 26, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO. The top McDry representatives for 2013 are as follows:
TORRANCE, CA — April 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, awarded Horizon Sales first place for achieving the highest Sayaka sales in 2013. The award was presented to Dave Trail, Principal, Horizon Sales, during a Wednesday, March 26, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO.
TORRANCE, CA — April 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that is now distributing the new UNITECH UC-250M-CV PCB Board Cleaner.
TORRANCE, CA — April 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that its 20th anniversary celebration held during the recent IPC APEX EXPO was a huge success. The company commemorated this anniversary with a special Taiko drum presentation at its booth.
TORRANCE, CA — February 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has introduced the new UA1780 Fit-Line Inspection Data Creation System to support the new HIOKI FA1240 Flying Probe Tester.
TORRANCE, CA — January 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that it will celebrate the company’s 20th year in business on Wednesday, March 26, 2014 during the IPC APEX EXPO.
Seika Machinery’s President, Mr. Isao Muraoka is traveling with Seika Corporation, Parent Company, President, Mr. Hiroyasu Nishi, and Mr. Takahashi Noriyuki, General Manager of New Business Development, Corporate Planning Dept. to help kick off the company’s 20th anniversary.
TORRANCE, CA — February 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the new McDry DXU-401DP Pass Through Dry Cabinet.
The cabinet features double-sided doors for easy access on either side of the SMT line. Multiple access doors allow operators to retrieve materials and replace them in a quick and efficient manner. The McDry manufacturer continues to develop dry cabinets that meet the demand and requirements of an increasingly time-sensitive market.
