Precision Non-Contact Cleaning for Semiconductor Applications

The PEN-G and PEN-S ultrasonic spot cleaners deliver powerful, localized cleaning using high-pressure ultrasonic air—ideal for removing fine particles in delicate, contamination-sensitive environments such as semiconductor production.

• PEN-G: Handy, gun-type design for mobile operation and flexible cleaning

• PEN-S: Fixed-mount design for integration into automated or workbench setups

Both models offer non-contact cleaning that reduces the risk of damage to delicate substrates while delivering high removal efficiency for fine particulate contamination.

Key Features

🔷 Ultrasonic Air Cleaning – Combines high-pressure air with ultrasonic vibration for advanced particle removal

🎯 Spot Cleaning Precision – Target localized contamination without affecting surrounding surfaces

🛠️ Two Configurations:

PEN-G: Handy gun type for manual operation

PEN-S: Fixed type for continuous or integrated use

🧼 Non-contact – Prevents scratches or abrasion on sensitive materials

⚡ Ideal for semiconductor wafers, photomasks, optical components, and precision substrates

Test Results

Results:

• Significant reduction of 3μm particles after cleaning

• Test conducted in SHINKO’s clean room (Note: Results may vary depending on material and environment)

Before Cleaning

After Cleaning

Before and After images available upon request or in attached materials.

Applications

• Semiconductor Manufacturing

• Microelectronics Assembly

• Precision Optics

• Flat Panel & Photomask Cleaning

• R&D and Lab Cleanroom Processes