Reproduce the temperature profile of the Reflow oven. Can observe the melting state of solder paste and record the process.

Features & Benefits:

  • The local matrix control system of upper heater makes possible reflow soldering of PCB in which the thermal capacity is balanced with the best heating temperature.
  • Each heating stage sets the temperature as well as the time. It makes it possible to change the time which keeps the reflow peak temperature free.
  • Can observe the state of soldering through wide glass windows from four directions: front, back, top, and bottom.
  • Reproduce nearly the same conditions as an actual reflow oven by using the hot air of the upper-heater and the extreme infrared radiation of the lower heater together.
  • Can heat in a N2 atmosphere and control N2concentration with the O2 Oxygen Analyzer, OAS-1, and N2 flow adjustable function. (OAS-1 is optional)

Specifications

ItemSpecification
Applicable Circuit BoardUp to 70W x 70L x 10H mm
Outer DimensionMain Unit : 320W x 285D x 310Hmm
Controller unit : 290W x 235D x 270Hmm
Heating MethodUpper-face : Hot air
Lower-face : Extreme infrared radiation
Cooling MethodFlowing air or N2 air (with flow adjustable valve)
Power Supply200V 50/60Hz 3kVA 3Phase
Air0.3 – 0.5MPa 100 liter/min (Maximum)
O2 Concentration in Furnace (when using N2)100ppm minimum (Heating furnace is sealed up)
PCB InstallationFlat plate system
Upper-Heaterhot air heater : Approx. 2.8kW (Approx. 350W x 8 series)
* Deviation to standard nozzle can be set.
Lower-HeaterExtreme infrared radiation heater : Approx. 360W
Temp. Accuracy5C maximum
(Maximum range : 50(W) x 50(L)mm in the center)
Measuring Temp. RangeRoom temp. – 330°C
Measuring Points3points
N2 Gas Supply Function25 liter/min. with flow regulating valve during operation.
ControlExclusive software <SRS-1CS> for Windows XP
WeightMain unit : Approx. 12kg
Controller unit : Approx. 8kg

* Specifications subject to change without notice.

Malcom Reflow Simulators: Products