Flying Probe Tester
- Evaluates solder joints between lands and leads by resistance testing
- 40 steps/sec. measuring rate
- AOI function checks component presence, polarity and displacement
- Soft-landing probes to prevent board and component damage
- Minimum probing pitch of 0.15mm
- Fast fixture-less setup
- Optional Gerber data based programming
- User-friendly Windows® 10 operation
Benefits of Flying Probe Tester
Rest assured the in-circuit testing of a surface mount technology board assembly is fast and efficient with Hioki’s FA1240 flying probe tester. The FA1240 tester offers a variety of benefits that conventional test equipment does not. Some of these benefits include fixture-less inspection for quick set up, and proficient testing of misplaced components, faulty components, and poor contacts. Through Hioki’s unique method of resistance testing, the exclusive solder joint integrity test is able to assess solder joints rapidly, while simultaneously preventing board and component damage through the use of Hioki’s soft-landing feature. Hioki’s four terminal measurement function, one that our competitors do not offer, can detect minute differences between inadequate and high-quality soldering. The standard automated optical inspection function is much more reliable than a simple visual check, and will analyze a component’s displacement, presence, and polarity. Hioki’s flying probe test can be executed at a rapid pace of up to 40 steps per second with a probing pitch of 0.15mm.
With its wide variety of measurement techniques for analyzing data, along with ultra-fast speed testing speed, the Hioki FA1240 flying probe tester is undeniably a cost effective way to efficiently and quickly assess any circuit board assembly with absolute confidence.