Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that its Solder Paste Recycling Unit has been selected for inclusion in The Innovative Technology Center (ITC) at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces HIOKI’s X-Y IN-CIRCUIT HiTESTER 1240 Series of high-speed, high-precision, high-reliability populated board flying probe testers that are ideal for high-mix, low volume production.
The 1240 Series features a four-wire measurement function and capabilities of the series extends to the active in-circuit test of FETs, relays, as well as three-terminal voltage regulators–applications that are regarded as challenging test issues for conventional equipment.
