Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
TORRANCE, CA — July 2025 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce the next installment of its webinar series: “Wireless Strain Measurement Solutions for PCB Testing.” The live event will take place via Zoom on Aug 6, 2025 at 1:00 PM EST, and is now open for registration.