Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that Michelle Ogihara, its Sales and Marketing Manager, will co-chair a presentation titled “Using Automated Inspection to Reduce Cost Through Process Capability and Control” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session PRC1, which is scheduled to take place Wednesday, October 7, 2009 from 8-9:30 a.m. in room Royal Palms 1-2.
Having capable and controllable assembly processes are essential elements that characterize successful electronics manufacturing companies. Why? High production yields result in low labor and scrap costs.
An assembly infrastructure that takes advantage of today’s automated inspection technologies assists in the goal of achieving best-in-class yields, as well as significantly reducing the labor costs associated with manual inspection. The key to process control is not to use these automated inspection tools reactively, but to use them proactively in real time — identifying a process trending toward an upper or lower specification limit, not waiting until a process goes out of control.
Micro packages such a 0201 and 01005s, lead-free solder, BGAs and other under-package I/O components all have confounded the inspection challenge. The papers in this session will document work that has been done to help meet these challenges.