Seika Introduces New Solder Paste Testing Solutions at IPC APEX Expo: Article

TORRANCE, CA — January 2020 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Seika will introduce the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom in Booth #3645.

Malcom PCU-285

The PCU-285 Spiral Viscometer is designed to measure solder paste viscosity. It offers new functions that make it possible to create, execute and store measurement programs with or without a PC. The system uses a touch panel display for improved functionality and visibility.

The viscometer features a compact and enhanced heating unit, making it easier to put inside or take out the sample, and simplifies cleaning. Additionally, the temperature control and viscosity measurement have been improved greatly in stability and speed.

Malcom Wave DS-10S Dip Tester

The Dip Tester DS-10S for selective soldering equipment improves process management efficiency by measuring solder temperature, soldering time, board temperature increases and peak conditions, soldering head movement speeds and solder head diameter all at once.

Seika also will show equipment from Hioki, Unitech, Sawa, McDry, Kyowa, and more respected names in the industry. Stop by the Seika booth during the IPC APEX EXPO to see these and much more from Seika! For more information about Seika’s complete product line, contact Michelle Ogihara at or visit