See Seika Machinery, Inc's New Advanced Machinery at IPC/APEX 2011: Article

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new advanced machinery in Booth #459 Mandalay Bay Resort & Convention Center in Las Vegas.

Seika’s new Solder Paste Recycling Unit enables approximately 90 percent of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste. As an additional benefit, the recycling unit enables selection of manual mode and automatic mode using a touch screen panel.

Seika will feature the new Sawa Eco-Roll large roll model that cleans wiper rolls up to 24″. The Sawa Eco-Roll eliminates waste and saves money by reusing wiper rolls for printing machines. In addition to providing a reduction in waste, use of the wiper roll cleaner results in reduced CO2 emissions in just 20 minutes.

Wiper rolls are widely used for under stencil cleaning to wipe off solder paste in the SMT printing process. Most of them are used only once, then are disposed of with other solder waste. Recycling wiper rolls not only reduces emissions but also reduces lumber usage. In addition, tests have shown that repeated cleaning of wiper rolls does not compromise the performance when cleaning stencil apertures.

At the show, Seika will debut the new Sawa Ecobrid handheld and fully automatic low-VOC emission stencil cleaner. The cleaner provides up to a 66 percent reduction in CO2 emissions, as well as a huge reduction in running costs. Additionally, the system cleans and dries in just five minutes.

Sawa Stencil Cleaners are widely used in the Japanese electronics industry to ensure high yields when screen printing solder paste onto PCBs. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications because a small amount of solder balls have a tendency to adhere to the corners of the apertures.

At the show, Seika will debut the MC-1002 PCB Storage Cabinet for the first time. The low-cost, high performance cabinet was developed to assist companies that are trying to conform to IPC-1601 August 2010 Printed Board Handling and Storage Guidelines.

The cabinet is ESD-IEC61340-5-1 compliant and grounded to prevent static electricity. The system is equipped with a digital RH meter and maintains a 3 percent RH level. Additionally, the PCB storage cabinet features locking doors and adjustable shelves that can hold up to 220lbs.

Also on display, the DXU-580AF Feeder Storage Cabinet features an ergonomic design for smaller quantity storage that may be placed on each line. This system can hold up to 20 feeders depending on the reel size and is ergonomic because it uses a sliding shelf for ease of installation and removal. The height and angle also are designed for most operators to handle feeder storage easily. As an option, this model features one shelf for storage of trays and extra reels.

The MB-301 Low Temperature & Low Humidity Baking Cabinet features a 40C° baking temperature, as well as a 5 percent RH humidity level during bake out period and 3 percent RH level in dry storage. The MB-301 cabinet comes standard with a drying unit and can be used as a regular dry storage cabinet when heater for baking is turned off. Additional features include a large display digital RH meter and a 1M? ground terminal.

Seika also will highlight new features for McDry Storage Cabinets, including the McDry Signal Tower and ERC-301AD Hygrometer with Alarm System. With the new hygrometer, the light signal will flash and audible alarm will sound off when the humidity level goes over the set limit over a fixed period of time. After the alarm flashes, the unit will save ten data readings, one per hour.

For the first time, Seika will debut the Seitec Bravo STS-2533 IN H & SJ Soldering System, specially-designed for in-line and modular selective soldering. The programmable system features a special nozzle design and a spray fluxer unit, enabling flawless soldering of leads and pads. Additional features include a conveyor with roller, a specially-designed solder pot and a drawer-type solder pot. The Bravo ST-2533 from Seitec is the ideal soldering solution for mass production.

Anritsu 3D Solder Paste Inspection System Seika’s Anritsu 3D Solder Paste Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator.

Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.

Sayaka Routers are the ideal solution for stress-free depanelization, providing a fixture-based highly efficient dust vacuum system. The routers provide clean and precise depanelization for densely populated PCBs, and the advanced image-processing software offers point-and-click operation for programming router paths. Additional features of Sayaka PCB Routers include automatic alignment compensation by CCD camera, user-friendly operation, extended bit life by automatic router bit depth adjustment, improved tact time, and a calibration-free linear robot.

Sayaka SAM-CT23Q and SAM-CT22S are tabletop, automatic precision PCB routers. The compact size and weight of these models are ideal for limited workspaces and versatility in production line set-up. A new large board size table top router has recently been released.

Finally, Sayaka SAM-CT23NJ/56NJ Series is comprised of fast and accurate stand-alone PCB routers, with a CCD camera and sophisticated image-processing software.

YJ Link’s SPI NG/Good Buffer is designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission, RS-232C interface with SPI, and NG PCB anti-touch verification. This method provides increased line efficiency and requires only minimal space for equipment. Using the SPI NG/Good Buffer, there is no need to filter NG PCBs and SPI operates normally, even during NG PCB verification.

YJ Link’s AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. This system also features a PCB shock-free and noncontact power transmission.

Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation.

For more information, stop by Booth #459 at the show.