Seika Machinery News: January 2010

Seika Machinery Inc. to Feature Leading Machinery at APEX 2010

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

3D Solder Paste Inspection Using Pad Reference with Multi Angle Sensor Technology

Solder paste inspection (SPI) traditionally uses resist height or a pseudo-pad height to calculate solder volume on a pad. However, as features are increasingly miniaturized and compressed on the PCB, resist thickness differences are making SPI measurements inaccurate. Toshiyuki Matsuoka, Anritsu Precision Co. Ltd. and Tim Cappoen, Seika Machinery Inc., discuss a new sensor technology that combines two optical systems to measure solder paste deposits from the true pad.