The Malcom TK-1 Tackiness Tester is widely used to help our customers predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.
Features & Benefits
- Quantifies solder-paste tackiness.
- Determines component drop-time, thus reducing costly rework.
- Three testing methods available.
- User-variable measurement conditions (time, preload, depth, and speed).
- Digital display of measured tackiness, real preload, and real insertion depth.
- Online computing capable with included PC software.
|Sensor range||0 – 500 gf|
|Sensor resolution||1 gf|
|Measurement methods||Continuous preload,
JIS Point Preload,
IPC Insertion depth
|0 – 500 gf
0 – 500 gf
0 – 200 µm
|20 – 500 gf
0.1 – 99.9 sec
0.1 – 10.0 mm/sec
0.2 – 9.9 mm/min
20 – 200 µm
|Accessories||Hand printer with 0.2 mm mask test piece,
5.1-mm dia. probe control and data analysis software
* Specifications subject to change without notice.