Key Features

  • The Sawa 500HE can clean stencils without removing them from the printing machine.
  • Stencils can be cleaned in just a few minutes.
  • Portable.

The Sawa 500HE removes solder balls from stencil apertures after normal wipe cleaning.  A small hand held ultrasonic cleaning head (2.36 in Diameter) is manually applied over apertures with IPA, water or a non-VOC solvent.  During application of the cleaning head, a small tray containing a foam pad soaked with solvent is held underneath the stencil to capture solder balls dislodged by the cleaning head.

Specifications

Note: The specifications are subject to minor change for improvement of the product.

Generator: W3.15 x D7.48 x H1.69 in 3 lbs approx
Transformer: AC100~240V 50/60kHz  40W
Tray: W10.63xD8.27xH1.18 in
Foam Pads: 20 pcs
Vibration Frequency: 40kHz